The single and double-sided PI insulation material combines our proprietary low-flow flame-retardant adhesive and polyimide film, which is suitable for laminated busbar applications that require moldable high-temperature dielectric materials.

Product Structures

1.Film Thickness：（25，50，75，125µm)

2.Glue Thickness：（25，30，38，50µm）

3.Width：（500mm）

Product Features

1) Comply with RoHS requirements and comply with UL 94 V-0.

2）The unique high-temperature-resistant and low-overflow glue makes PS1779 very suitable for laminated busbars that require multiple laminated processes.

3）High bond strength provides superior adhesion to copper, aluminum, and most of the metal to be plated.

4）Adhesive thickness (± 0.1 mil).

5）Reduce processing time, prevent copper oxidation, and eliminate expansion and contraction ratio.

6）The finished product can reach 125°C of UL’s lowest continuous use temperature rating.